| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flexible copper-plated board or rigid flexible copper-plated board whose shape is satisfactory, and whose reliability is high by preventing the contamination of a surface layer copper foil due to the scattering of processing waste. <P>SOLUTION: Perforation auxiliary materials constituted of a specific sheet are arranged on the surface of a flexible copper-plated board or a rigid flexible copper-plated board, and the surface is directly irradiated with a laser so that blind via holes can be formed, or auxiliary materials for perforation constituted of a specific sheet different from the material are arranged on the backside, and the backside is directly irradiated with a laser in the same way so that the blind via holes and/or through-holes can be formed. Thus, it is possible to prevent the contamination of a surface layer foil, and to manufacture a flexible print wiring board or a rigid flexible print wiring board having the holes whose shapes are satisfactory, and whose reliability is excellent. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
