| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed-wiring board for flip-chip mounting capable of mounting a flip chip, without creating a bump on the back of a semiconductor chip. SOLUTION: The method of manufacturing a printed wiring board for mounting a flip chip comprises the steps of forming a thermosetting resin constituent layer b having a surface unevenness of 3μm or smaller on a circuit board c, which is formed of a board covered with a metal foil and is provided with a conductor circuit a thereon; removing a part of a thermosetting-resin constituent layer b that corresponds to a bump connection region of a semiconductor chip to form an opening d, and exposing the conductor circuit; filling in the opening with a solder or a copper plating e; and attaching a soldering paste f on the filled solder or copper plating e to heat and form a spherical solder bump, to smooth a spherical parietal region, and to make all the heights the same. COPYRIGHT: (C)2005,JPO&NCIPI |
