| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus in which an increase in oxygen concentration in the treatment apparatus can be surely suppressed. SOLUTION: Seven gas-blowing nozzles 68 are arranged on the upper face of a transportation arm 60. Each gas-blowing nozzle 68 is connected to a gas-feed pipe 67, and the gas-feed pipe 67 is connected to a nitrogen-gas feed unit 20 via a valve 69. When the valve 69 is opened while a wafer is held on the transportation arm 60, an nitrogen gas from the nitrogen-gas supply unit 20 is fed to blow the nitrogen gas to the entire space between the substrate W held and the transportation arm 60. By feeding the nitrogen gas between the substrate and the transportation arm 60 before transporting the substrate into a chamber 15, room air interposed between the two can be replaced with the nitrogen gas, and as a consequence, the introduction of the room air into the chamber 15 by the transportation arm 60 is prevented to surely suppress an increase in oxygen concentration in the chamber 15. COPYRIGHT: (C)2005,JPO&NCIPI
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