| 摘要 |
PROBLEM TO BE SOLVED: To provide a film hardly causing breakage during peeling by combination with a multi-layered film having peeling resistance, the film being used for manufacture of a printed circuit board or the like in which the film is liable to be broken during peeling after heat transfer. SOLUTION: The multi-layered film comprises two or more layers of resins. At least one layer is of a crystalline resin A, another layer is of an amorphous resin B, and these are alternately stacked up to five or more layers in the thickness direction. At least one surface is of the crystalline resin, and three-dimensional average surface roughness (SRa) is not less than 250nm. COPYRIGHT: (C)2005,JPO&NCIPI
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