| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball in use for micro soldering for surface mounting on a substrate of electronic equipment, particularly a solder ball that is effective for preventing discoloration, and also to provide the manufacturing method. SOLUTION: The solder ball is characterized in that an organic film for forming a complex compound with solder alloy components is positioned on the surface of the solder ball having a grain size of 0.05-1.0 mm. The solder ball is coated on the surface with an organocompound film which is solid under ordinary temperature and which is dissolved to disappear at a solder melting temperature when heated in a reflow soldering process. Consequently, a change in the surface characteristics such as discoloration under a mechanical abrasive environment of the solder ball, which used to be difficult conventionally, can be eliminated. COPYRIGHT: (C)2005,JPO&NCIPI
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