| 摘要 |
A light emitting diode package includes a substrate, a conductive material, a LED chip, and a lens. The substrate has an upper surface formed with a P-electrode and a N-electrode, a lower surface formed with a cavity, and a through hole penetrating the substrate from the upper surface to the lower surface. The conductive material is filled within the cavity of the substrate. The LED chip is located within the through hole of the substrate and is mounted on the conductive material, and is electrically connected to the P-electrode and the N-electrode of the substrate. The lens is covered over the LED chip. |
