发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To control soft-error and latch-up of a semiconductor device. <P>SOLUTION: A p-well layer 9 and an n-well layer 15 are provided in parallel on the main surface of a p-type silicon substrate 1, and an STI8 is provided selectively to the surface area of the well layer. Moreover, a deep n-well layer 14 is selectively provided to the part just under the n-well layer 15 and to the bottom of the p-well layer 9 opposing to the region between STs 18 of the p-well layer 9, the deep n-well layer 14 is not provided to the bottom of the p-well layer 9 opposing to the ST18, and the bottom of the p-well layer 9 opposing to the STI8 is in contact with the p-type silicon substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005259938(A) 申请公布日期 2005.09.22
申请号 JP20040068610 申请日期 2004.03.11
申请人 TOSHIBA CORP 发明人 NAKAI TAKEMICHI
分类号 H01L21/74;H01L21/76;H01L21/761;H01L21/8238;H01L21/8244;H01L27/092;H01L27/11 主分类号 H01L21/74
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