| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method for CMP by which the state of a metallic layer left on the surface of a wafer being polished can be detected in real time. <P>SOLUTION: The device for CMP is provided with a platen 1 which has a polishing pad 5 on its surface and rotates, and a wafer holding mechanism 8 which rotates while the mechanism 8 holds the wafer 7 having the metallic layer on its surface in a state where the mechanism 8 presses the wafer 7 against the polishing pad 5 and polishes the wafer 7. The platen 1 and polishing pad 5 are transparent. The device is also provided with an illuminating means 12 which illuminates the surface of the wafer 7 being polished through the platen 1 and polishing pad 5 and an image pickup device 11 which takes the picture of the surface of the wafer 7 being polished through the platen 1 and pad 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
