| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency circuit module that can solve such problems that high-frequency circuit boards cannot be placed near aerial wires to avoid loop oscillation, it is difficult to firmly and stably maintain a distance between the aerial wire and the high-frequency circuit board though both the aerial wire and the high-frequency circuit board need be isolated by the use of an aerial wire support material and packaging density is decreased because of an extended clearance between the case and a cover, resulting in the enlargement of the case. SOLUTION: A distance between an aerial wire and a high frequency circuit board can be firmly and stably maintained by providing a ceiling circuit board facing the high frequency circuit board instead of the aerial wire. In addition, a small high-frequency circuit module with a high latitude of design can be achieved because the case can be made compact in size by mounting some or all of the electronic components on a connection destination (high frequency circuit board) on the ceiling circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
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