| 摘要 |
PROBLEM TO BE SOLVED: To eliminate an excessive film and deposit which will be formed in a square shape substrate periphery and a square shape substrate-end in a short time. SOLUTION: Plasma formed under atmospheric pressure is sprayed from the substrate upper and lower sides (two directions), film removal of the round edge of a substrate 10 is performed, and furthermore, vacuum is performed from substrate-end side. Reaction vessels 15a, 15b to which plasma is sprayed have a profile (part of which is bend) in which plasma is sprayed slantingly to a substrate surface. In this film stripper, a substrate can be also held perpendicularly or slantingly to a horizontal plane. COPYRIGHT: (C)2005,JPO&NCIPI
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