发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment device for performing easier recovery work if a process is completed irregularly in the course of the process on the substrate. SOLUTION: The substrate treatment device comprises a plurality of treatment chambers for treating a plurality of substrate sheet by sheet, a transferring chamber which is adjacently connected with a plurality of treatment chambers to transfer the substrates to be treated in the treatment chambers, a first storage area for storing a sequence recipe to define the treatment sequence of the substrates in the treatment chambers, and a control unit for controlling the treatment of the substrates in the treatment chambers on the basis of the stored sequence recipe. Moreover, this substrate treatment device further comprises a second storage area for storing, corresponding to the sequence recipe, a post recipe defining the process for setting temperatures and pressures in the treatment chambers to predetermined states, and a post recipe executing unit for executing a post recipe stored corresponding to the sequence recipe in which the treatment is interrupted when the treatment is interrupted during the execution of the treatment based on the sequence recipe. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005259931(A) 申请公布日期 2005.09.22
申请号 JP20040068554 申请日期 2004.03.11
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KATAOKA NORIHIKO;FUNAKURA MITSURU;TERANISHI ISAO
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利