发明名称 |
Method for manufacturing light-emitting diode |
摘要 |
A method for manufacturing a light-emitting diode (LED) is described. The method comprises: providing a temporary substrate; forming an illuminant epitaxial structure on the temporary substrate; forming a first transparent conductive layer on the illuminant epitaxial structure; forming a metal substrate on the first transparent conductive layer; forming an adhesion layer on the metal substrate; providing a supporting substrate, wherein the supporting substrate is connected to the metal substrate by the adhesion layer; removing the temporary substrate, so as to expose a surface of the illuminant epitaxial structure; forming a second transparent conductive layer on the exexposed surface of the illuminant epitaxial structure; and forming an electrode on a portion of the second transparent conductive layer.
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申请公布号 |
US2005208691(A1) |
申请公布日期 |
2005.09.22 |
申请号 |
US20040960616 |
申请日期 |
2004.10.06 |
申请人 |
SHEI SHIH-CHANG;CHEN YEN-WEI;CHEN WEI-SHOU;CHANG CHIA-SHENG;LO HSIN-MING;SHEN CHIEN-FU |
发明人 |
SHEI SHIH-CHANG;CHEN YEN-WEI;CHEN WEI-SHOU;CHANG CHIA-SHENG;LO HSIN-MING;SHEN CHIEN-FU |
分类号 |
H01L21/30;H01L21/46;H01L27/15;H01L33/00;H01L33/40;H01L33/42;(IPC1-7):H01L21/30 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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