发明名称 |
A PROCESS AND APPARATUS FOR IMPROVING AND CONTROLLING THE CURING OF NATURAL AND SYNTHETIC MOLDABLE COMPOUNDS |
摘要 |
A process for curing a moldable compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a plurality of sensors distributed within a curing mold, wherein the moldable compound is a dialectric for each of the sensors; (2) determining impedance related measurements from the data streams for the plurality of sensors; (3) determining predictive and/or corrective curing actions for enhancing the curing process using the impedance related measurements for the plurality of sensors; and (4) controlling the mass production curing of parts to obtain cured parts having one or more desired properties. |
申请公布号 |
WO2005086965(A2) |
申请公布日期 |
2005.09.22 |
申请号 |
WO2005US08254 |
申请日期 |
2005.03.11 |
申请人 |
SIGNATURE CONTROL SYSTEMS, INC.;SCHNEIDER, SCOTT;MAGILL, RICHARD |
发明人 |
SCHNEIDER, SCOTT;MAGILL, RICHARD |
分类号 |
B29C35/02;G01N27/02;G01N33/44 |
主分类号 |
B29C35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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