发明名称 A PROCESS AND APPARATUS FOR IMPROVING AND CONTROLLING THE CURING OF NATURAL AND SYNTHETIC MOLDABLE COMPOUNDS
摘要 A process for curing a moldable compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a plurality of sensors distributed within a curing mold, wherein the moldable compound is a dialectric for each of the sensors; (2) determining impedance related measurements from the data streams for the plurality of sensors; (3) determining predictive and/or corrective curing actions for enhancing the curing process using the impedance related measurements for the plurality of sensors; and (4) controlling the mass production curing of parts to obtain cured parts having one or more desired properties.
申请公布号 WO2005086965(A2) 申请公布日期 2005.09.22
申请号 WO2005US08254 申请日期 2005.03.11
申请人 SIGNATURE CONTROL SYSTEMS, INC.;SCHNEIDER, SCOTT;MAGILL, RICHARD 发明人 SCHNEIDER, SCOTT;MAGILL, RICHARD
分类号 B29C35/02;G01N27/02;G01N33/44 主分类号 B29C35/02
代理机构 代理人
主权项
地址