WAFER-LEVEL OPTO-ELECTRONIC TESTING APPARATUS AND METHOD

摘要

A wafer-level testing arrangement for opto-electronic devices formed in a
silicon-on-insulator (SOI) wafer structure utilizes a single opto-electronic
testing element to perform both optical and electrical testing. Beam steering
optics may be formed on the testing element and used to facilitate the
coupling between optical probe signals and optical coupling elements (e.g.,
prism couplers, gratings) formed on the top surface of the SOI structure. The
optical test signals are thereafter directed into optical waveguides formed in
the top layer of the SOI structure. The opto~electronic testing element also
comprises a plurality of electrical test pins that are positioned to contact a
plurality of bondpad test sites on the opto-electronic device and perform
electrical testing operations. The optical test signal results may be
converted into electrical representations within the SOI structure and thus
returned to the testing element as electrical signals.