| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy for semiconductor packaging, a solder alloy capable of preventing a soldered joined part from breaking by falling impact, and also to provide its manufacturing method, solder balls and electronic members. SOLUTION: There are provided a solder alloy for semiconductor packaging is characterized in that it has Sn, Ag and Cu as the main components, containing 1-5 mass% Ag, 0.1-2 mass% Cu, and in addition 0.0005-0.5 mass% in total of one or more kinds of elements selected from an element group which consists of Mg, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, with the balance composed of Sn and inevitable impurities; and a manufacturing method of this solder alloy, solder balls and electronic components using this solder alloy. COPYRIGHT: (C)2005,JPO&NCIPI
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