发明名称 |
Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method |
摘要 |
Abrasive grains have mainly grains with a roundness of 0.50 or more and 0.75 or less, where the roundness is defined as the ratio of the circumference of a circle having the same area as that of a grain to the perimeter of that grain. An abrasive has the abrasive grains and at least one of an oxidizer, an oxide solution, an abrasive grain dispersion agent and a basic compound. An abrasive solution has the abrasive grains and water or hydrophilic substance. |
申请公布号 |
US2005205836(A1) |
申请公布日期 |
2005.09.22 |
申请号 |
US20050071589 |
申请日期 |
2005.03.04 |
申请人 |
HITACHI CABLE, LTD. |
发明人 |
YOSHIZAWA CHIE;UEMATSU SATOSHI;MASHIYAMA HISASHI;TANI TAKEHIKO |
分类号 |
B24B37/00;B24D99/00;B44C1/22;C09K3/14;C09K13/00;H01L21/302;H01L21/304;H01L21/306;(IPC1-7):C09K13/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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