发明名称 PLASMA PROCESS APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma process apparatus capable of giving different plasma energy according to the kind of gas for plasma treatment. <P>SOLUTION: The invention comprises a gas supply portion for supplying gas G1 and G2 for plasma treatment to a vacuum container 50 and a plasma generation portion 15 for generating plasma in the vacuum container 50. In a plasma CVD apparatus 60 for applying the plasma treatment to a deposition substrate 2 in the vacuum container 50, the plasma generation portion 15 is provided on a position away from the deposition substrate 2 such that a plurality of plasma regions 10a and 10b different in region area are formed. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005260186(A) 申请公布日期 2005.09.22
申请号 JP20040073496 申请日期 2004.03.15
申请人 SHARP CORP 发明人 ODA TOMOHIKO
分类号 H05H1/46;C23C16/509;H01L21/205;H01L21/31 主分类号 H05H1/46
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