| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for forming a coil on a semiconductor device by a simple method. SOLUTION: The semiconductor device 100 comprises a first semiconductor element 102 and a second semiconductor element 104. Further, the semiconductor device 100 comprises a coil 20 constituted of a first conductor 12a provided on the first semiconductor element 102, and a second conductor 12b provided on the second semiconductor element 104 while being wound around a central axis in a direction horizontal to the first semiconductor element 102. The coil 20 is formed in a region wherein the electrode pad 22 and the first connecting electrode 24a of the first semiconductor element 102 and the second connecting electrode 24b of the second semiconductor element 104 are formed. COPYRIGHT: (C)2005,JPO&NCIPI
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