发明名称 THERMAL EXPANSION SUPPRESSION SUPPORTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a thermal expansion suppression supporting structure, the application and the use of which are not limited, which has high versatility, and can keep a constant space between members used as references before and after thermal expansion. SOLUTION: A thermal expansion suppression supporting structure comprises at least two members different in coefficients of thermal expansion. The structure supports an object 3 to a fixed position relative to a reference point 5. The reference point 5 and a point 6 on the object 3 are linked to each other in at least two systems using a plurality of rod members 1 of the same member. A linking portion between the rod members 1 of a first system is linked to a linking portion between the rod members 1 of a second system using a linking rod member 2. This linking rod member 2 is formed of a member whose coefficient of thermal expansion is larger than those of other rod members 1's. The length of the linking rod member 2 having a large coefficient of thermal expansion is specified such that a constant space between the point 6 on the object 3 and the reference point 5 before and after atmosphere temperature change is kept. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005260190(A) 申请公布日期 2005.09.22
申请号 JP20040073557 申请日期 2004.03.15
申请人 NEC CORP 发明人 ARAKI KAZUNARI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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