| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer method which avoids deterioration of a thin-film device such as a thin-film transistor formed on a transferred layer in a transfer method of the transferred layer, to provide a manufacturing method of a semiconductor device, and to provide an electronic apparatus. SOLUTION: The method to transfer the transferred layer formed on a substrate to other base materials comprises: a first step to form a first isolation layer on the substrate; a second step to form the transferred layer including the thin-film device and a recess on the first isolation layer; a third step to form a protective layer at a region in which at least the recess of the transferred layer is formed; and a fourth step to bond the substrate on which the protective layer is formed to the other base materials through an adhesive layer. COPYRIGHT: (C)2005,JPO&NCIPI
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