| 摘要 |
PROBLEM TO BE SOLVED: To securely control the shape of a bump and arbitrarily control the mounting height of a component. SOLUTION: A component mounting apparatus comprises a holding means 22 for holding a first component 26, a support means 36 for supporting a second component 48 on which the first component 26 is mounted, heating means 20, 34 for heating at least one of the first component 26 or the second component 48, a temperature measuring means for measuring temperatures of the heating means 20, 34, a separation distance measuring means for measuring a separation distance between the holding means 22 and the support means 36, a computing means for computing a separation distance between the first component 26 and the second component 48 on the basis of the measurement result of the temperature measuring means and the separation distance measuring means, a driving means for driving at least one of the holding means 22 or the support means 36 to change the position thereof, and a control means for controlling the driving means on the basis of the computation result of the computing means. COPYRIGHT: (C)2005,JPO&NCIPI
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