MANUFACTURING METHOD AND PLATING LIQUID OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide the manufacturing method of the semiconductor device capable of embedded wiring without bringing about a faulty connection derived from the progress in microfabrication. SOLUTION: The embedded wiring by electrolytic plating is materialized by using such a plating liquid that a metal may be used whose ionization tendency is higher than that of metal used as wiring material, and its metal concentration may be made small. COPYRIGHT: (C)2005,JPO&NCIPI