发明名称 PRODUCTION PROCESS OF FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board exhibiting excellent quality of appearance and excellent high temperature bonding strength between a polyimide film and a conductor in which curl is eliminated and no flaw, e.g. scratch or irregularities, occurs on the surface of the conductor. SOLUTION: A flexible sheet-like substrate produced by coating the roughened surface of a conductor directly with polyimide based precursor resin solution and then drying it, a sheet-like material having mean surface roughness Ra of 0.5μm or above, and a sheet-like protective material having smooth surface are passed through respective guide rolls. On a rotary roll, three layers are laid in layer in such an order as the sheet-like material is located on the flexible sheet-like substrate side and the sheet-like protective material is located on the conductor side. The three layers are wound around the outer surface of a tubular body being rotated forcibly to produce a multilayer tubular body which is then placed in a thermosetting furnace and the polyimide based precursor resin layer is thermoset thus producing a flexible printed wiring board. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005259791(A) 申请公布日期 2005.09.22
申请号 JP20040065855 申请日期 2004.03.09
申请人 NIPPON STEEL CHEM CO LTD 发明人 SUGANO KATSUHIRO
分类号 B05D7/04;B05D7/24;H05K3/00;(IPC1-7):H05K3/00 主分类号 B05D7/04
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