发明名称 PLATING METHOD FOR ELECTRONIC COMPONENTS AND MEMBER FOR MASK USED FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a plating method for electronic components having excellent packaging strength and component destruction strength and a member for a mask used for the same relating to a plating method for electronic components used for portable equipment, such as personal computers, digital video camera (DVC) equipment, digital still camera (DSC) equipment, mini-disk (MD) equipment, and mobile communication equipment and a member for a mask used for the same. SOLUTION: An internal electrode 11 is formed by inserting a ferrite core 17b into a hole 21 disposed at the member 19 for the mask formed of an elastic body to immerse the core in the plating liquid, and plating a collar part 17a of the ferrite core 17b not in contact with the member 19 for the mask with the member 19 for the mask as a mask by an electroless plating method. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005256035(A) 申请公布日期 2005.09.22
申请号 JP20040066612 申请日期 2004.03.10
申请人 TDK CORP 发明人 SATO HIROSHI;MORI KANEO;YANO KENZO;NARISAWA YUKI
分类号 C23C18/06;(IPC1-7):C23C18/06 主分类号 C23C18/06
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