| 摘要 |
PROBLEM TO BE SOLVED: To provide a floor covering composition comprising new epoxy resin excellent in low temperature curing property, finished appearance of coating film and to provide a floor covering. SOLUTION: The invention relates to the epoxy resin-based floor covering composition comprising (A) a compound containing hetrocyclic ring and expressed by general formula (1) and/or formula (2), (B) a polyepoxy compound having at least two epoxy groups in the molecule, (C) a formaldehyde condensate of phenols and aliphatic polyamines, as essential component. In formulae (1) and (2), n is an integer of 1-10; Y<SP>1</SP>and Z<SP>1</SP>each independenly is an oxygen or sulfur atom; R<SP>1</SP>and R<SP>2</SP>are each a residue removed of the epoxy group part from an epoxide (D). COPYRIGHT: (C)2005,JPO&NCIPI
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