Method and apparatus for separating disc-shaped substrates

摘要

A method for separating bonded substrates and a respective apparatus used for that method is disclosed. The method comprises positioning the bonded substrates ( 1 ) in an evacuable chamber ( 2 ) by respective means, detaching a space ( 10 ) from that evacuable chamber by means of a sealing arrangement ( 4 ) so that said space comprises a partial area of the substrates with at least one gap ( 5 ) between the bonded substrates ( 1 ), lowering the pressure in the vacuum chamber ( 2 ) while maintaining the pressure in the space ( 10 ), thereby causing the bonded substrates to separate.