POLISHING PAD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

A polishing pad capable of maintaining high-precision end-point optical detection over a long period from the start of the use to the end of the use even if polishing is preformed with an alkaline or acid slurry and a method for manufacturing a semiconductor device using this polishing pad are disclosed. The polishing pad is used for chemical mechanical polishing and has a polishing region and a light-transmitting region. If T1 is the light transmittance (%) of the light-transmitting region measured to the measurement wavelength lambda after the polishing pad is dipped in a KOH aqueous solution of pH 11 or an H2O2 aqueous solution of pH 4 for 24 hours and T0 is the light-transmittance (%) measured to the measurement wavelength lambda before the dipping, the difference DeltaT(DeltaT=T0-T1) (%) between T0 and T1 is within 10 (%) over the whole range of the measurement wavelength from 400 to 700 nm.