| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of a pin hole at the time of soldering the lead of an electronic component and a connection land when the dimension of a lead insertion hole in a circuit board is larger than the cross-sectional dimension of the lead of an electronic component or when the cross-sectional shape of the lead of an electronic component does not match the shape of the lead insertion hole in the circuit board. SOLUTION: Solder is prevented from returning back to a leading land from a connection land after being cut by forming a separation band between the leading land and the connection land. COPYRIGHT: (C)2005,JPO&NCIPI
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