Verfahren und System zum Herstellen einer im Wesentlichen ringförmigen Lotverbindung

摘要

Production of a ring-like solder joint between two components comprises preparing a first surface wettable with the solder; preparing a second surface wettable with the solder; applying the solder to the surface of at least one of the components; joining the components; and fusing the solder so that a solder joint is formed between the two surfaces. The first surface is segmented on at least one of the components and the solder is applied to the segmented surface. Preferred Features: The first component is a circuit carrier. The second component is a chip. The surfaces have a metallization. The metallization is made of TiW/Cu, NiV/Cu or Ni/Au.