发明名称 |
SUBSTRATE DIVIDING SYSTEM, SUBSTRATE MANUFACTURING EQUIPMENT, SUBSTRATE SCRIBING METHOD AND SUBSTRATE DIVIDING METHOD |
摘要 |
<p>A substrate dividing system, which is compact with a small installation area and can efficiently divide a substrate. A clamping apparatus (50) is provided to hold at least one side edge part of a mother board carried into a hollow rectangular parallelepiped mount (10) and is permitted to reciprocate along one side of the hollow rectangular parallelepiped mount (10). A pair of substrate dividing apparatuses for dividing the mother substrate clamped by the clamping apparatus (50) from the upper plane and the lower plane of the mother substrate, respectively, are provided on a dividing apparatus guide body (30) so as to move along a direction orthogonally intersecting with a moving direction of the clamping apparatus (50). At the time of moving the clamping apparatus (50) which is holding the mother substrate, the substrate supporting apparatus supports the mother substrate without sliding on the mother board.</p> |
申请公布号 |
WO2005087458(A1) |
申请公布日期 |
2005.09.22 |
申请号 |
WO2005JP04478 |
申请日期 |
2005.03.14 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.;NISHIO, YOSHITAKA;OKAJIMA, YASUTOMO;OSHIMA, YUKIO;OHNARI, HIROYUKI;YOSHIMOTO, KAZUHIRO |
发明人 |
NISHIO, YOSHITAKA;OKAJIMA, YASUTOMO;OSHIMA, YUKIO;OHNARI, HIROYUKI;YOSHIMOTO, KAZUHIRO |
分类号 |
B26F3/00;B27B5/06;B28D1/04;B28D5/02;B65G49/06;C03B33/023;C03B33/027;C03B33/03;(IPC1-7):B26F3/00 |
主分类号 |
B26F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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