| 摘要 |
PROBLEM TO BE SOLVED: To reduce the transmission loss of a line for transmitting a high frequency signal at low costs. SOLUTION: This high frequency wiring board 10 is provided with a dielectric substrate 20, a signal line 30 formed on one surface of the dielectric substrate 20, a ground conductor 40 formed on the other surface of the dielectric substrate 20, a coating layer 50 for coating the signal line 30 and a sealing layer 60 for sealing the signal line 30 coated with the coating layer 50. The dielectric substrate 20 is constituted of resin materials, and materials whose dielectric tangent is smaller than that of the materials of the sealing layer 60 are used for the coating substrate 50. COPYRIGHT: (C)2005,JPO&NCIPI |
