| 摘要 |
PROBLEM TO BE SOLVED: To provide a peel-off method capable of easily peeling off from an adherend such as a semiconductor chip and the like a themosensing adhesive tape adhered to the surface of the adherend using an adsorption collet. SOLUTION: A method of peeling off a thermosensing adhesive tape comprises steps of reducing the adhesive power of the thermosensing adhesive tape 2 adhered to an adherend 1 such as a semiconductor chip and the like by a temperature change, allowing an adsorption collet 3 to be adsorbed to the surface of the thermosensing adhesive tape 2, and peeling off the thermosensing adhesive tape 2 from the adherend 1 by adsorption. The method of peeling off the thermosensing adhesive tape is characterized in that the adsorption collet 3 is adsorbed under the condition that the center position of the thermosensing adhesive tape 2 does not coincide with the position of a perpendicular line projected on the surface of the thermosensing adhesive tape 2 from the center position of the adsorption collet 3. COPYRIGHT: (C)2005,JPO&NCIPI |
