| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition apparatus capable of performing film deposition by generating stable plasma at high efficiency. SOLUTION: A sputtering apparatus 1 as a thin film deposition apparatus comprises a vacuum container 11 to maintain the inside in a vacuum state, and a plasma generating means 80 connected to the vacuum container 11 to generate plasma in the vacuum container 11. The plasma generating means 80 comprises a dielectric plate 83 formed of a dielectric material, antennas 85a, 85b installed adjacent to the dielectric plate 83, a case body 81 which forms an antenna storage chamber 80A to store the antennas 85a, 85b together with the dielectric plate 83, a pipe 15a to exhaust the antenna storage chamber 80A in a vacuum state, and a vacuum pump 15. The inside of the vacuum container 11 and the antenna storage chamber 80A are partitioned by the dielectric plate 83 to form an independent space. COPYRIGHT: (C)2005,JPO&NCIPI
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