| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition obtained by using a curing accelerator and having excellent curability in moist state, fluidity, cracking resistance in solder reflow, and characteristics after being left at high temperature; and to provide an electronic component device having an element sealed with the composition. SOLUTION: The curable resin composition contains a curable resin, the curing accelerator represented by general formula (I) (wherein, R<SP>1</SP>to R<SP>3</SP>are the same or different and each a hydrogen atom or a 1-18C substituted or nonsubstituted hydrocarbon group, or may form a cyclic structure obtained by bonding two or more of them; R<SP>4</SP>to R<SP>7</SP>are the same or different and each a hydrogen atom or a 1-18C substituted or nonsubstituted monovalent organic group; Y<SP>-</SP>is a group obtained by releasing one proton from a 0-18C monovalent group having at least one releasable proton; with the proviso that two or more of R<SP>4</SP>to R<SP>7</SP>, and Y may be bonded to each other to form a cyclic structure), and an inorganic filler which includes an inorganic filler having a flame-retardant effect. COPYRIGHT: (C)2005,JPO&NCIPI
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