发明名称 POLISHING CLOTH, MANUFACTURING METHOD OF POLISHING CLOTH, POLISHING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing cloth capable of uniformly mixing two or more kinds of abrasives on the polishing cloth, a polishing device and a manufacturing method of semiconductor device. <P>SOLUTION: A storage portion for temporary storing the abrasives is equipped, and the storage portion is provided near a part including a center portion of the polishing cloth. By rotations of the polishing cloth, the abrasives stored in the storage portion are stirred and mixed in the storage portion. The stirred and mixed abrasives flow out from the storage portion by rotations of the polishing cloth to be supplied to the polishing cloth. In order to further stir and mix the abrasives, a fin is provided in the storage portion, and a wall portion structuring the storage portion is formed to be double, or a flowing out portion is provided on the wall portion. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005254401(A) 申请公布日期 2005.09.22
申请号 JP20040071031 申请日期 2004.03.12
申请人 SEIKO EPSON CORP 发明人 IKEDA KOJI
分类号 B24B57/02;B24B37/00;B24B37/20;B24B37/24;H01L21/304 主分类号 B24B57/02
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