发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition suitable for direct recording by a semiconductor laser, a YAG laser, etc., having high sensitivity, and not requiring post-exposure-baking. <P>SOLUTION: The positive photosensitive composition showing a difference in solubility in an alkali developer as between an exposed portion and a non-exposed portion, which comprises, as essential components inducing the difference in solubility, (a) a light-absorbing dye having an absorption band covering a part or whole of a wavelength region of from 650 nm to 1.06 &mu;m and (b) a novolac resin and/or a polyvinyl phenol resin as a high molecular compound, and further comprises (c) a solubility-suppressing agent, and the composition is configured such that it has no photosensitivity to ultraviolet light. The solubility-suppressing agent reduces the dissolution rate, in the alkali developer, of a blend comprising a light-absorbing dye of component (a) and a high molecular compound of component (b). <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005258451(A) 申请公布日期 2005.09.22
申请号 JP20050084185 申请日期 2005.03.23
申请人 MITSUBISHI CHEMICALS CORP 发明人 MURATA MASAHISA;NAGASAKA HIDEKI
分类号 G03F7/004;B41C1/10;B41M5/36;B41M5/40;B41M5/46;B41N1/08;G03F7/00;G03F7/023;G03F7/027;G03F7/032;G03F7/039;G03F7/20;H01L21/027 主分类号 G03F7/004
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