| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and method for correcting pattern by which the position of a mask pattern composed of through holes formed by releasing the stress of a thin film can be corrected accurately by quickly and accurately calculating the displacement of the pattern. <P>SOLUTION: The relation between an experimentally found characteristic value and a stiffness matrix is entered in advance in a database. The stiffness matrix becomes to conform to a mask which becomes an actual object to be processed. In a pattern correcting process, a mask pattern to be processed is divided into unit areas (ST21), and the characteristic value of the mask pattern is calculated at every unit area (ST22). Then the stiffness matrix is found at every unit area by referring to the data base (ST23), and the displacement of the mask pattern is found at every unit area by solving a stiffness equation by using the stiffness matrix (ST24). In addition, the position of the mask pattern is corrected at every unit area in accordance with the found displacement of the mask pattern. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
