| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP apparatus and method which can estimate the occurrence of slip-out of a wafer during polishing and can detect the occurrence of chipping or cracking of the wafer during polishing. <P>SOLUTION: The CMP apparatus for polishing the wafer 7 comprises a platen 1 which has a polishing pad 5 on the surface and is rotated, and a wafer holding mechanism 8 which is rotated while holding the wafer 7 in such a manner as to press the wafer 7 against the polishing pad. The CMP apparatus is also equipped with a wafer outer shape detecting means 11 for detecting the outer shape of the wafer being polished, and an outer shape change calculating means 12 for calculating a change in detected outer shape of the wafer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
