| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for light emitting devices wherein its constitution is so simple as to be able to manufacture it at low cost, and the warpage of its substrate-its heat radiating material can be suppressed efficiently when an LED generates heat, and further, the designs of its electric and thermal wiring portions can be altered freely in X-Y-Z-axis directions. <P>SOLUTION: The solving means is formed out of a substrate 1 having both electric wiring portions 3 and thermal wiring portions 2, a heat radiating plate 4 having protrusions 7 disposed in the opposite positions to the thermal wiring portions 2, a raw material having a high heat conductivity, and has adhesive layers 6 interposed between the backside of the substrate 1 and the heat radiating plate 4. By the adhesive layers 6, the substrate 1 and the heat radiating plate 4 are bonded to each other in a body in the state of the protrusions 7 abutting on the thermal wiring portions 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
