PALLADIUM-SILVER ALLOY ELECTROPLATING BATH

摘要

PROBLEM TO BE SOLVED: To provide a practicable palladium-silver alloy electroplating bath having satisfactory stability, free from remarkable variation in the composition, and capable of easily forming a palladium-silver plating film having an objective alloy composition. SOLUTION: The palladium-silver alloy electroplating bath is composed of an aqueous solution comprising : (1) palladium ions in 5 to 200 mmol/l; (2) silver ions in 0.5 to 20 mmol/l; and (3) at least one kind of anions selected from the group consisting of nitric acid ions and sulfuric acid ions in 20 to 2,000 mmol/l, and whose pH is controlled to 9 to 12 by the addition of ammonia. COPYRIGHT: (C)2005,JPO&NCIPI