| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating apparatus which inhibits a plated layer formed on a main substrate from being etched by a plating liquid and inhibits an unnecessary plated layer from being formed on the main substrate, by discharging the plating liquid more quickly than ever, and to provide a method for discharging the plating liquid. SOLUTION: This electroplating apparatus has a bottom raising member 13 having a second through-hole 13a arranged in the perimeter of a first through-hole 11b. The outer side face 13d of the bottom raising member 13 is located nearer to the center of a plating tank 11 than the inner side face 11c of the plating tank. Thus, configured electroplating apparatus eliminates a need for discharging the plating liquid 18 gathered in a space 16 between the outer side face 13d of the bottom raising member 13 and the inner side face 11c of the plating tank 11, and shortens a period of time for discharging the plating liquid 18 more greatly than ever. COPYRIGHT: (C)2005,JPO&NCIPI
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