SURFACE STRUCTURING BY MEANS OF A FILM,申请号WO2004EP53464-传众专利搜索

发明名称	SURFACE STRUCTURING BY MEANS OF A FILM
摘要	According to the invention, the surface of a substrate is structured with the aid of a film, said surface especially representing a surface having a significant topography.
申请公布号	WO2005066392(A3)	申请公布日期	2005.09.22
申请号	WO2004EP53464	申请日期	2004.12.14
申请人	SIEMENS AKTIENGESELLSCHAFT;KASPAR, MICHAEL;REBHAN, MATTHIAS;WEIDNER, KARL	发明人	KASPAR, MICHAEL;REBHAN, MATTHIAS;WEIDNER, KARL
分类号	C23C18/16;C25D5/02;H01L21/288;H01L21/768;H05K1/00;H05K1/18;H05K3/10;H05K3/24;H05K3/40	主分类号	C23C18/16
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