| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tray, a socket for inspection, and a method for manufacturing a semiconductor device that can improve the quality of a product and reduce the cost. <P>SOLUTION: The tray 7 is provided with a plurality of pockets 7a, in which wafer level CSPs 5 can be stored and each pocket 7a is provided with a pedestal part 7b which supports a plurality of solder bumps 3 of a waver level CSP 5, and a sidewall 7c which is formed around the pedestal part 7b. When a wafer level CSP 5 is stored in the pocket 7a of the tray 7 through transfer between processes during the postprocessing for manufacturing the wafer level CSP 5, formation of flaws in an organic film on the main surface of a semiconductor chip and sticking of the organic film having peeled off, on the product as foreign matters can be prevented not by supporting the organic film, but supporting the plurality of solder bumps 3 by the pedestal 7b, so that the yield and the quality of the waver level CSP 5 (semiconductor device) can be improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
