| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor device which can increase a positional accuracy, a reliability and a productivity. <P>SOLUTION: The method comprises the steps of forming a bump 3 on a surface on which a semiconductor chip 5 is to be joined thereto, subjecting the bump 3 to a levelling process, mounting the semiconductor chip 5 on a bump 3' subjected to the levelling process, and joining the bump 3' to the semiconductor chip 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
