| 摘要 |
PROBLEM TO BE SOLVED: To improve a stack assembly structure to achieve component sharing, component reduction, and a miniaturized compact stack by reviewing conventional stack structures. SOLUTION: This power semiconductor stack is integrally assembled by alternately stacking a plurality of flat power semiconductor devices 1 corresponding to arms of respective phases U, V, W and water cooled cooling bodies 2. Main circuit terminals, connecting conductors 8, 9 corresponding to U, V, W and P, N are upwardly and downwardly led out from respective cooling bodies to construct a three-phase bridge circuit. The polarity of the semiconductor devices for the V-phase arm arranged in the center of the stack is set opposite to that of the semiconductor devices for the U-, W-phase arms arranged on both sides of the V-phase arm. Via the cooling bodies stacked between adjacent phase arms, the main circuit terminals 12 and the connecting conductors 8, 9 corresponding to P, N poles common to both phase arms are led out. Further, a terminal seat 2c is formed on the outer peripheral surface of the cooling body 2, and a main circuit terminal plate 12 is fastened thereto by bolts. This cooling body is used as a common component, and by inverting the direction thereof, respective terminals on the AC-side, DC-side can be led out upwardly and downwardly from the stack. COPYRIGHT: (C)2005,JPO&NCIPI |
