| 摘要 |
PROBLEM TO BE SOLVED: To providy a capacity type humidity sensor superior in the adhesion of a substrate and a humidity-sensitive film, and to provide its manufacturing method. SOLUTION: The capacity type humidity sensor 100 is equipped with a semiconductor substrate 10, having a pair of electrods 31 and 32 arranged in the same plane so as to be spaced apart from each other, arranged in facing relation, and the humidity-sensitive film 50, comprising a polyimide polymer formed on the semiconductor substrate 10 so as to be covered between a pair of the electrodes 31 and 32 and a pair of the electrodes 31 and 32. An intermediate film 60 comprising a trialkoxysilane compound or a trichlorosilane compound covalently bonded to the humidity-sensitive film 50 is provided in between the humidity-sensitive film 50 and the surface (silicon nitride film 40) of the semiconductor substrate 10 brought into contact with the humidity-sensitive film 50. Accordingly, the semiconductor substrate 10 and the humidity-sensitive film 50 are bonded more closely by a covalent bond which is superior to the hydrogen bond in bonding energy, than before. COPYRIGHT: (C)2005,JPO&NCIPI
|
