发明名称 ALIGNMENT EQUIPMENT AND FILM FORMING EQUIPMENT
摘要 <p>An accuracy of alignment of a substrate with a mask is improved and a film forming plane of the substrate after film forming is protected by eliminating a positional shift of the substrate at the time of moving up and down a magnet. A substrate holding mechanism is provided for holding the substrate (5) to freely move it up and down against the mask (6), which is made of a magnetic material and is supported by a mask holder (11), an alignment mechanism is provided for aligning the mask (6) with the substrate (5), and a magnet lifting mechanism (12) is provided for moving up and down against the substrate (5) a magnet (7), which brings the mask (6) into close contact with the substrate (5). The substrate holding mechanism is provided with a plurality of substrate holding units (10) which have a pair of first and second hooks (21) and (22) to hold the periphery of the substrate (5). The magnet lifting mechanism (12) is provided with a magnet holder (61) fixed at the lower edge of a lifting shaft (62), and a substrate holder (64), which is suspended relatively movable to the magnet holder (61) to face an upper plane of the substrate (5).</p>
申请公布号 WO2005087969(A1) 申请公布日期 2005.09.22
申请号 WO2005JP03173 申请日期 2005.02.25
申请人 ULVAC, INC.;TANAKA, HISATO 发明人 TANAKA, HISATO
分类号 H05B33/10;C23C14/04;G03F9/00;H01L21/68;H01L51/50;H05B33/14;(IPC1-7):C23C14/04 主分类号 H05B33/10
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