发明名称 SEMICONDUCTOR LASER EQUIPMENT
摘要 <p>Semiconductor laser equipment is provided with a structure, which prevents corrosion of a cooling medium flow path of a heat sink and stably cools a semiconductor laser array for a long period of time. The semiconductor laser equipment is provided with a semiconductor laser stack, a cooling medium feeder, insulating piping and a cooling medium. The cooling medium feeder feeds the semiconductor laser stack with the cooling medium. The cooling medium is composed of fluorocarbon. The insulating piping is an insulating pipe having flexibility. In the insulating piping, a grounded conductor is arranged. The conductor functions to remove static electricity generated when the cooling medium communicates in the insulating piping.</p>
申请公布号 WO2005088788(A1) 申请公布日期 2005.09.22
申请号 WO2005JP03979 申请日期 2005.03.08
申请人 HAMAMATSU PHOTONICS K.K.;MIYAJIMA, HIROFUMI;KAN, HIROFUMI 发明人 MIYAJIMA, HIROFUMI;KAN, HIROFUMI
分类号 H01L23/473;H01S5/024;H01S5/40;(IPC1-7):H01S5/024 主分类号 H01L23/473
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