| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element which has a structure where a conductive substrate for reinforcement is stuck to a light emitting layer part through a metal layer for reflection, whose manufacturing is easy and which can sufficiently maintain a reflection factor of a reflection face that the metal layer forms. <P>SOLUTION: The light emitting element 100 has a compound semiconductor layer 50 having the light emitting layer part 24 and a current diffusion layer 20 formed on the first main surface of the light emitting layer part 24. The second main surface of the compound semiconductor layer 50 is connected to the first main surface of a Si substrate 7 forming a conductive element substrate through a reflection metal layer 10. The reflection metal layer 10 is formed of a metal which is mainly composed of Au, Ag or Al. The reflection metal layer 10 and the Si substrate 7 are stuck trough a conductive adhesive layer 11 where metal particles which are mainly composed of Ag, Al, Cu or Ni or conductive particles formed of carbon black and the like are bonded with high molecular bonding material composed of an epoxy polymeric material. an urethane polymeric material and an acrylic polymeric material. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
