| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting element by which handling can easily be performed even if a growing substrate is removed from a compound semiconductor layer having a light emitting layer part. <P>SOLUTION: The compound semiconductor layer 50 is epitaxially grown on the first main surface of the growing substrate and a temporary support substrate 110 is stuck to the first main surface of the compound semiconductor layer 50 through a metal temporary support connection layer 25. The growing substrate is removed by chemical etching and the like. A bonding metal layer 31 is formed on the second main surface of the compound semiconductor layer 50 where the growing substrate 1 is removed and alloying thermal treatment is performed. An element substrate 7 is stuck to the second main surface of the compound semiconductor layer 50 through a metal layer 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
